COOLER MASTER Coolermaster Thermal Compound HTK-001

This thermal interface compound is developed by Sh

COOLER MASTER Coolermaster Thermal Compound HTK-001

This thermal interface compound is developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists between the top of the processor and the base of the heat sink. Cooler Master specifically designed this application kit to give you professional results every time and instantly, as it would come off the production line.

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